Full mirror light penetration; Latest ARGB (Addressable RGB) technology
High speed low latency performance
Aluminum alloy heat sink with high performance
Auto Overclocking; Supports Intel & AMD motherboards (ASUS, GIGABYTE, MSI, ASROCK); Selected high-quality IC; OC profile support; Energy saving with ultra-low working voltage; visit www.teamgroupinc.com for more compatibility information
Lifetime warranty; 3600MHz CL18 16GB Kit (2x8GB); Latency CL18-22-22-42; Data Transfer Bandwidth 28,800 MB/s (PC4 28800); Voltage 1.35V; Dimensions 48.7(H) x 133.7(L) x 8.1(W)mm; Module Type 288 Pin Unbuffered DIMM Non ECC
